To support our technology roadmap, we have recently invested in two new 6-spindle drilling machines. These represent best-in-class equipment currently available on the market and mark a significant step forward in expanding our drilling capacity and technology capabilities.
Drilling defines the electrical interconnections between layers. The accuracy, stability, and consistency of this step directly affect signal integrity, reliability, and overall product performance.
At Aspocomp, drilling is a high-precision process driven by optical alignment, real-time process control, and continuous accuracy management, combined with deep application expertise for high-performance designs.
What drilling enables
- Creation of plated through-holes (PTH) and via structures
- Precise vertical interconnections in multilayer PCBs
- A strong foundation for high-reliability plating and assembly
In high-end applications, drilling requires:
- Micron-level positioning accuracy
- Tight diameter and depth control
- Consistent hole quality across complex stack-ups
Advanced capabilities we focus on:
Backdrilling for signal integrity
Removing unused stubs in multilayer PCBs through high-resolution optical alignment and adaptive process control for micron-level accuracy.
High aspect ratio drilling
Enabling reliable drilling of deep holes in thick multilayer designs while maintaining hole quality and positional accuracy.
High-speed and deep drilling (peck drilling)
Optimized for demanding materials, high layer counts, and challenging drilling depths.
Coin drilling applications
Supporting specialized hole geometries and advanced stack-ups where controlled depth and surface interaction are critical.
HDI-ready precision alignment
Enabled by optical alignment systems and continuous accuracy calibration.
Process stability and real-time control
Including tool condition monitoring, broken tool detection, and automatic compensation to ensure consistent quality and early defect prevention.
Why this matters for our customers
- Reliable electrical performance in high-frequency, high-speed, and mission-critical applications
- Reduced risk of defects in downstream processes
- Capability to support complex HDI and multilayer designs
- Increased capacity and flexibility with scalable, high-quality output
Part of our ongoing investment program
These investments strengthen our core manufacturing processes and support our long-term growth.
Our drilling platform includes advanced features such as non-contact tool measurement and automated accuracy control, ensuring consistent quality, repeatability, and long-term process stability.
We continue to develop our capabilities to deliver high-reliability PCBs for demanding applications – combining top-tier equipment with deep process expertise.
This investment is partly co-funded by the European Union (JTF funding).