Printed circuit boards for high frequency applications are typically designed on special base materials. Aspocomp has a long history of processing a vast variety of these special materials.
Our history begins in 1985 when we manufactured PTFE-based PCBs for the first time. We processed our first multilayer high frequency PCB in 1998.
Since then we have kept improving our experience of different base materials – and today we can process many different materials and even mixed buildups.
High frequency PCBs are typically used in radio and high speed digital applications such as 5G wireless communication, automotive radar sensors, aerospace, satellites and more. High frequency laminates provide lower attenuation and constant dielectric properties compared to PCBs of conventional FR4 materials. Aspocomp has specialized in the manufacture of multilayer and HDI PCBs of high frequency dielectric materials.
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For more information about our base material offering please see our laminate options