Aspocomp Oulu Technical Milestones

  • 2020 PTFE pressing started
  • 2018 Contactless hard gold for connectors
  • 2018 First laser milled cavities manufactured
  • 2016 Vacuum etching for inner layers started
  • 2015 Local RF implants on PCB
  • 2013 Anylayer HDI PCBs enabled by Horizontal viafill plater
  • 2012 Coin technology for thermal management started
  • 2010 CCD routing/drilling for heavy metal and high precision
  • 2008 Introduction of viafill process for stacked microvias
  • 2007 First 3+n+3 HDI PCBs (staggered)
  • 2005 First 2+n+2 HDI PCBs (staggered)
  • 2003 IPC Type VII viafarms (POFV) started
  • 2002 Manufacturing of PCBs with metalback heatsinks started
  • 2000 First mixed buildup with RF material and FR4
  • 1999 Introduction of multilayer PCBs of high frequency laminates
  • 1998 Aspocomp Oulu starts microvia PCB production
  • 1989 Sequential blind via technology introduced in Oulu
  • 1987 First multilayer PCB manufactured
  • 1985 First Teflon PCBs manufactured
  • 1979 PCB manufacturing in Oulu started