Aspocomp Group Plc
Other information disclosed according to the rules of the Exchange
ORGANIZATION OF THE BOARD OF ASPOCOMP GROUP PLC
Espoo, Finland, 2017-03-23 11:45 CET (GLOBE NEWSWIRE) —
Aspocomp Group Plc, Company Announcement, March 23, 2017 at 12:45 p.m.
In its organization meeting held today, the Board of Directors of Aspocomp Group Plc re-elected Päivi Marttila as Chairman of the Board and Kaarina Muurinen as Vice Chairman.
The Board of Directors has at its meeting evaluated the independence of the Board members in compliance with the recommendations of the Finnish Corporate Governance Code. It is the view of the Board of Directors that all Board members, other than Ms. Julianna Borsos, are independent of the company’s significant shareholders. The Board of Directors has also assessed that all the Board members are independent of the company.
Board committees were not established as the extent of the company’s business did not require it.
For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.
ASPOCOMP GROUP PLC
Aspocomp – a service company specializing in PCB technologies
Aspocomp specializes in demanding PCB technologies, serving its customers throughout the entire life cycle of a product. Aspocomp sells and manufactures PCBs and also provides related design and logistics services as well as technology solutions. Aspocomp creates value for its customers with unique products and solutions, strong manufacturing and technology expertise, as well as fast and reliable deliveries. A wide network of expert partners together with Aspocomp’s own manufacturing enables its customers to cost-effectively buy their PCBs from a single provider over the entire life cycle of a product.
A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp’s customers are companies that design and manufacture telecom systems and equipment, automotive and industrial electronics, security technology and semiconductor testing systems.