MIKKO MONTONEN APPOINTED AS THE PRESIDENT AND CEO OF ASPOCOMP GROUP PLC

Published:
2014-02-27 07:15:00 CET
Aspocomp Group Plc
Changes board/management/auditors

MIKKO MONTONEN APPOINTED AS THE PRESIDENT AND CEO OF ASPOCOMP GROUP PLC

Espoo, Finland, 2014-02-27 07:15 CET (GLOBE NEWSWIRE) —

Aspocomp Group Plc, Changes Management, February 27, 2014 at 8:15 a.m.

Mr. Mikko Montonen, 48, M.Sc., has been appointed President and Chief Executive Officer of Aspocomp Group Plc as of May 15, 2014. Mr. Montonen currently works at Okmetic Plc as the Executive Vice President of Customers and Markets and the Deputy to the President.

Mikko Montonen has over 20 years’ experience from Okmetic Plc where he has been successfully in charge of sales to and customer relations of, inter alia, car electronics and semiconductor customers both in America and Europe. 

The current President and Chief Executive Officer Mr. Sami Holopainen will continue in his position until May 15, 2014, and with the company until May 31th, 2014.

The Board of Directors of Aspocomp wishes to thank Mr. Holopainen for his contribution to the company for over 13 years.

For further information please contact Mr. Tuomo Lähdesmäki, Chairman of the Board, tel. +358 50 5879 648.

ASPOCOMP GROUP PLC
Board of Directors

www.aspocomp.com

Aspocomp – PCB technology company

Aspocomp develops and sells PCB manufacturing services. Our seasoned professionals help customers to create the most optimal PCB designs, both in terms of performance and cost. Our trimmed production lines produce the most challenging designs with the shortest lead-times in the industry. Our volume supply services offer cost-efficient access to all PCB technologies.

A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp’s PCBs are used in many applications, such as telecommunication networks and devices, automotive electronics, security and medical systems, chipset development and industrial automation.