PCBs With Component Cooling Features for Thermal Management

Aspocomp provides a wide variety of PCBs with a designed-in cooling feature for high power components.

You can choose a tailored solution right under the component that leads heat flow efficiently through the PCB. Aspocomp can provide the following PCB cooling technologies:

  • Via farm cooling by filled+capped vias / IPC Type VII / POFV (provided by Aspocomp since 2003)
  • Pre-bonded metalback (since 2002)
  • Post-bonded metalback (since 2002)
  • Embedded T-coin (since 2012)
  • Embedded I-coin (since 2012)
  • Embedded C-coin (since 2012)

Embedded coin technology enables the insertion of a piece of solid copper right under the component.

A PCB designer’s loop for thermal design and optimization goes as follows:

  1. Thermal simulation and design
  2. PCB manufacturing
  3. PCB assembly
  4. Thermal measurements and/or thermal images
  5. Analyzing the results
  6. Thermal benchmark

An example result of a test arrangement and benchmark: “Thermal path with T coin has only 50% of the thermal resistance compared to a similar-sized viafarm.”

Each solution has a different thermal resistance and cost background.

Please contact us to find the most optimal solution for your application-specific thermal challenges.