2013-10-24 08:30:03 CEST
Aspocomp Group Plc
Financial Calendar


Espoo, Finland, 2013-10-24 08:30 CEST (GLOBE NEWSWIRE) —

Aspocomp Group Plc, Financial Calendar, October 24, 2013 at 09:30 a.m.

Aspocomp Group Plc will publish its financial information in 2014 as follows:

Financial Statements 2013: Thursday, February 27
Annual Report 2013: Thursday, March 13
Interim Report January-March: Thursday, April 24
Interim Report January-June: Thursday, August 7
Interim Report January-September: Thursday, October 23

The Financial Statements and Interim Reports will be released at around 9:00 am on the given dates.

The silent period commences two weeks prior to publication of the interim results and three weeks prior to Financial Statements.

The Annual General Meeting will take place on Thursday, April 24. The meeting will be convened by the company’s Board of Directors later on. Shareholders have a right to put on the agenda of the AGM 2014 items that are within the competence of the General Meeting. A shareholder must declare his or her demands in writing to Aspocomp Group Plc.’s Board of Directors on Friday, March 7, 2014 at the latest by mail to address Aspocomp Group Plc., Yhtiökokous, Keilaranta 1, 02150 Espoo or by email to

For further information, please contact Sami Holopainen, CEO,
tel. +358 20 775 6860, sami.holopainen(at)


Sami Holopainen

Aspocomp – a PCB technology company

Aspocomp develops and sells PCB manufacturing services. Our seasoned professionals help customers to create the most optimal PCB designs, both in terms of performance and cost. Our trimmed production lines produce the most challenging designs with the shortest lead-times in the industry. Our volume supply services offer cost-efficient access to all PCB technologies.


A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp’s PCBs are used in many applications, such as telecommunication networks and devices, automotive electronics, security and medical systems, chipset development and industrial automation.