Aspocomp
RFQ
  • FIN (FIN)
  • ENG
  • Industries and solutions
    • Automotive PCB Solutions
    • PCBs for the Semiconductor Industry
    • Telecom PCB Solutions
    • Industrial Electronics
    • Security, Defense and Aerospace
  • Products and Services
    • PCB Products
      • High Speed Digital PCB
      • Advanced HDI PCBs
      • High Layer Count Multilayer PCBs
      • PCBs With Component Cooling Features for Thermal Management
      • High Frequency PCBs
    • Services
      • Fast Deliveries – Quick Turn Services (QTA PCBs)
      • Design Support Services
      • Logistics Solutions
      • Volume Supply Services – PCB Trading
    • Capability and resources
      • Aspocomp Oulu Technical Milestones
      • Laminate Options
        • Mid Tg FR4
        • High Tg FR4
        • Halogen-free FR4
        • HDI Dielectric / Prepreg
        • High Frequency Laminates
      • Generic PCB Information
  • News and blog
  • Aspocomp Group
    • Mission
    • History
    • Yearly key figures
    • Careers
    • Quality
    • General Sales Terms
    • Values
  • Investors
    • Invest in Aspocomp
      • Strategy
      • CEO’s review
      • Responsibility
        • Economical responsibility
        • Social responsibility
        • Environmental responsibility
        • Aspocomp’s Code of Conduct
    • Key Figures
      • Yearly key figures
      • Quarterly key figures
      • Formulas and definitions
    • Shares and shareholders
      • Price
      • Share
      • Dividend Policy
      • Shareholders
      • Major Shareholders
        • Shareholder history
      • Flaggings
        • Notifications to Aspocomp
      • Authorizations
      • Stock Option Program and Share-based Compensation Plan
      • Shareholder register and changes of address
      • Transactions of Managers
    • Reports
      • Interim reports
      • Annual reports
      • Insider’s dealing
      • Capital Markets Day
      • Leverage from the EU 2014-2020
      • Pressrealeases
      • Presentations
      • Annual Reports Subscription
      • Stock Exchange releases
    • Corporate governance
      • Annual General Meeting
      • Board of Directors
        • Board members
        • Committees
        • Charter of the Board
      • Management Team
      • Remuneration
        • Board
        • Management
        • Incentive systems
        • Auditor
      • Controls
      • Insider Administration
      • Auditors
      • Corporate Governance Statement
    • Analysts
    • Investor Calendar
  • Contacts
    • Management Team
    • Sales and marketing
    • Customer Service
    • Manufacturing
    • Press and investors
    • Image bank
    • Request For Quotation
    • Aspocomp’s Privacy Policy
    • Web Master
  • Extranet
  • Leverage from the EU 2014-2020
RFQ
  • FIN (FIN)
  • ENG

Home AGM 2017

AGM 2017

Annual General Meeting 2017

The Annual General Meeting 2017 was held on Thursday, March 23, 2017 at 10 a.m. (EET), address Keilaranta 1, 1st floor Auditorium, Espoo, Finland. 

 

 

Minutes of the AGM

 

 

Notice to the AGM 2017

 

 

 

 

Board of Director’s proposals to the AGM 2017

 

 

Proposed composition for Aspocomp’s Board of Directors

 

 

Proxy template

 

 

Privacy policy

 

Aspocomp

Aspocomp Group Plc

PCB manufacturer and supplier with own factory in Oulu and a partner network in Europe and China.

Keilaranta 1
FI-02150 ESPOO
FINLAND

tel: +358 20 775 6860
firstname.surname(at)aspocomp.com

  • Industries and solutions
  • Products and Services
  • News and blog
  • Aspocomp Group
  • Investors
  • Contacts
  • Extranet

By clicking “Ok”, you agree to the storing of cookies on your device to enhance site navigation, analyze site usage, and assist in our marketing efforts. Read More.

Ok