- 2020 PTFE pressing started
- 2018 Contactless hard gold for connectors
- 2018 First laser milled cavities manufactured
- 2016 Vacuum etching for inner layers started
- 2015 Local RF implants on PCB
- 2013 Anylayer HDI PCBs enabled by a horizontal viafill plater
- 2012 Coin technology for thermal management started
- 2010 CCD routing/drilling for heavy metal and high precision
- 2008 Introduction of viafill process for stacked microvias
- 2007 First 3+n+3 HDI PCBs (staggered)
- 2005 First 2+n+2 HDI PCBs (staggered)
- 2003 IPC Type VII viafarms (POFV) started
- 2002 Manufacturing of PCBs with metalback heatsinks started
- 2000 First mixed buildup with RF material and FR4
- 1999 Introduction of multilayer PCBs of high frequency laminates
- 1998 Aspocomp Oulu starts microvia PCB production
- 1989 Sequential blind via technology introduced in Oulu
- 1987 First multilayer PCB manufactured
- 1985 First Teflon PCBs manufactured
- 1979 PCB manufacturing in Oulu started