Aspocomp Group Plc
Financial Calendar
ASPOCOMP’S FINANCIAL INFORMATION AND ANNUAL GENERAL MEETING IN 2017
Espoo, Finland, 2016-10-28 09:00 CEST (GLOBE NEWSWIRE) —
Aspocomp Group Plc, Financial Calendar, October 28, 2016 at 10:00 a.m.
Aspocomp Group Plc will publish its financial information in 2017 as follows:
Financial Statements 2016: Tuesday, February 14
Annual Report 2016: Tuesday, February 28
Interim Report January-March, 2017: Thursday, April 27
Half-yearly Report January-June, 2017: Friday, August 11
Interim Report January-September, 2017: Thursday, October 26
The Financial Statements, Half-yearly Report and Interim Reports will be released at around 9:00 am EEST on the given dates.
Annual Report contains Financial Statements, the report of the Board of Directors and Corporate Governance Statement.
Aspocomp’s silent period commences 30 days prior to the publication of its financial information.
The Annual General Meeting 2017 will take place on Thursday, March 23 at 10:00 a.m. EEST. The meeting will be convened by the company’s Board of Directors later on.
For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.
ASPOCOMP GROUP PLC
Mikko Montonen
CEO
Distribution:
Nasdaq Helsinki
Major media
www.aspocomp.com
Aspocomp – PCB technology company
Aspocomp develops and sells PCB manufacturing services, focusing on the end-to-end fulfillment of customers’ PCB needs. Our seasoned professionals help customers to create the most optimal PCB designs, both in terms of performance and cost. Our trimmed production lines produce the most challenging designs with the shortest lead-times in the industry. Operating as a service business, we provide one-stop access to technology solutions and competitive products for all PCB technologies.
A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp’s PCBs are used in many applications, such as telecommunication networks and devices, automotive electronics, security and medical systems, chipset development and industrial automation.
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