SAMPO BANK OPPOSES THE MERGER OF ASPOCOMP OY WITH THE PARENT COMPANY
Aspocomp Group Oyj Company Announcement September 19, 2007 at 1:00 pm
The Board of Directors of Aspocomp Group Oyj decided on May 10, 2007 to merge the subsidiary Aspocomp Oy with its parent company. The planned registration date for the implementation of the merger was September 30, 2007. According to the disclosure received today by Aspocomp, Sampo Bank plc opposes the planned merger. Aspocomp will consider available options and announce the consequent measures after having examined the matter further.
Aspocomp Oy’s business is related to printed circuit board production in Finland.
For further information, please contact Maija-Liisa Friman, CEO,
tel. +358 9 7597 0711.
ASPOCOMP GROUP OYJ
President and CEO
Aspocomp: Innovative interconnection solutions for the electronics industry
The Aspocomp Group develops and offers high technology interconnection solutions for the electronics industry in close cooperation with its customers. Aspocomp supplies printed circuit boards for mobile data terminal equipments, data communications networks and automotive industry. The company supports its global customers in developing new technologies and offers a fast route from product development to applications and volume production. The Group’s production facilities are located in Finland, China and Thailand. In 2006, its net sales stood at EUR 149 million and it had about 3,350 employees.
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