Aspocomp Group Oyj – Managers’ Transactions

Aspocomp Group Plc
Managers’ transactions

Aspocomp Group Oyj – Managers' Transactions

Espoo, Finland, 2016-11-29 15:00 CET (GLOBE NEWSWIRE) —
Aspocomp Group Plc, Insider’s dealing, November 29, 2016 at 4:00 p.m.

Aspocomp Group Oyj – Managers’ Transactions
____________________________________________

Person subject to the notification requirement
Name: Montonen, Mikko
Position: Chief Executive Officer
Issuer: Aspocomp Group Oyj
LEI: 743700W8ZIJAMXWWWD26

Notification type: INITIAL NOTIFICATION
Reference number: 743700W8ZIJAMXWWWD26_20161129121010_2
____________________________________________

Transaction date: 2016-11-28
Venue: NASDAQ HELSINKI LTD (XHEL)
Instrument type: SHARE
ISIN: FI0009008080
Nature of the transaction: EXERCISE OF A STOCK OPTION
(X) Linked to stock option programme

Transaction Details
(1): Volume: 90000 Unit price:  N/A

Aggregated transactions
(1): Volume: 90000 Volume weighted average price:  N/A

For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.

ASPOCOMP GROUP PLC

Mikko Montonen
CEO

Distribution:
Nasdaq Helsinki
Major media
www.aspocomp.com

Aspocomp – PCB technology company

Aspocomp develops and sells PCB manufacturing services, focusing on the end-to-end fulfillment of customers’ PCB needs. Our seasoned professionals help customers to create the most optimal PCB designs, both in terms of performance and cost. Our trimmed production lines produce the most challenging designs with the shortest lead-times in the industry. Operating as a service business, we provide one-stop access to technology solutions and competitive products for all PCB technologies.

A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp’s PCBs are used in many applications, such as telecommunication networks and devices, automotive electronics, security and medical systems, chipset development and industrial automation.